Our SME designs CMOS optical sensors with industrial applications. The process of developing the final product “optical sensor” includes several stages: sensor design, simulation analysis, silicon wafer fabrication, chip testing, bonding and packaging, sensor implementation in a mass-market circuit board, final testing of the finished product.
All processes except design and final testing are performed by external contractors, which increases the cost of the final product. This project proposal seeks two types of services:
Service 1 - to acquire knowledge about and design a system for the “chip scale package (CSP) chip testing at the wafer level” stage
Service 2 - to accumulate knowledge and tools for the final product testing stage according to the latest EMVA 1288 v4.0 standard.
Service 1 will enable us to build a local prototype for the testing stage based on the designed system and start performing in-house activities.
Service 2 is necessary because until now we have been using EMVA 1288 v3 (2016 standard) for optical sensor analysis, and the industry, although generally conservative, is already looking for a comparison of sensor parameters with EMVA 1288 v4.0 (the latest European standard for optical sensors).
Activities
Activity
Contracted Amount
Reported Amount
Услуги за иновации в полза на МСП: Услуга 1: Проектиране на автоматизирана система за тестване на небондирани чипове върху силициеви пластини с под милиметрова точност на позициониране
Услуга 2: Трансфер на знание и адаптиране на процедури по валидация и бърз предварителен анализ на параметри на оптични сензори според стандарта EMVA 1288 версия 4.0
29 420.00
0.00
Notes:
Elements in light blue allow detailed view when selected
All amounts are in Bulgarian lev (BGN) / 1 EUR = 1,95583 BGN
